Our Capabilities

IC Design: Analog / Mixed-Signal / Microwave / mmW / SoC

Processes: SiGe, CMOS, GaN, GaAs, InP

Package Design: Flip-Chip CSP, BGA, LGA, MCM

Module Design: PCB, MCM, Hybrid, Hermetic & Non-Hermetic, Hi-Rel

Electromagnetic Simulation: HFSS, EMX, Signal Integrity, Structures, Antennas

Radar system, waveform, and signal processing design

Calibration